[labnetwork] SPTS DRIE Question

[Shepard, Jeremiah J]

Page 38 of the presentation linked below discusses the issue you are having I think.

https://www.purdue.edu/discoverypark/birck/files/Plasma_RIE_Etching_Fundamentals_and_Applications.pdf

Jerry Shepard
Purdue University
Birck Nanotechnology Center

From: labnetwork-bounces at mtl.mit.edu <labnetwork-bounces at mtl.mit.edu> On Behalf Of bob.henderson at etchedintimeinc.com
Sent: Thursday, February 27, 2020 12:16 PM
To: labnetwork at mtl.mit.edu
Subject: [labnetwork] SPTS DRIE Question

I know a number of you have SPTS DRIE systems and I would like to ask what hardware configuration is necessary to prevent undercut (Footing) at the sacrificial stop layer at completion of etch. I have been told that it requires a different frequency generator than 13.56 MHz used for the bulk etch. Do the newer tools also have some method of endpoint on the stop layer or is it just a timed etch? Your help is appreciated

Bob Henderson
Etched In Time, Inc
941 S. Park Lane
Tempe, Arizona 85281
Phone: 602-206-6154
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