[labnetwork] SPTS Technologies

[Steve Vargo]

Hi All,

                The key to controlling the footing (also called notching, this is the sidewall attack seen on insulating stop layers) is using pulsed bias power. This can be done with either HF or LF bias power operation, as long as the bias generator can apply it in a controllable and pulsed mode operation. On newer SPTS DRIE etch modules (Rapier or DSi-v) this is done with either HF (13.56 MHz) or LF (380 kHz) pulsing with recipe controlled setpoints for the pulsing ON time and pulsing OFF time. In most applications the use of HF pulsed bias power is the default operation but in some unique applications the use of LF pulsed bias power yields better results. Our default offering on new DRIE etch modules uses HF bias power but LF bias power is an optional upgrade should it be needed.

If you let me know model or serial no. of the SPTS system in question I can advise further on what might be best for notch control.

And as Greg mentioned, the use of endpoint control for monitoring the actual Si etch will enable the best path for minimal notch size. Our newer DRIE modules utilize our Claritas OES endpoint system which is class-leading in terms of operations for all applications. This monitors the Si etch process and can be setup to change the DRIE recipe conditions based on Si etch feedback. This enable process time control as well as soft-landing conditions on etch stop layers.

Hope that helps.

Regards,
Steve

Stephen Vargo, Ph.D., Senior Global Applications Manager
SPTS Technologies, Inc., A KLA Company
T. | M. +1 (626) 233-0687          spts.com

From: Greg Hollingshead <Greg.Hollingshead at spts.com>
Sent: Friday, February 28, 2020 12:52 PM
To: mtkhbeis at gmail.com; labnetwork at mtl.mit.edu; bob.henderson at etchedintimeinc.com
Cc: Steve Vargo <Steve.Vargo at spts.com>
Subject: SPTS Technologies

Hello Dr. Michael Khbeis and Bob Henderson;

We can usually control undercutting (footing) at a stop layer and/or provide endpoint on a stop layer.  However, not knowing the stop layer material or the system you are using it is difficult to advise further.  If you are using a legacy system this may or may not be possible.

Can you give Steve and I more information on the etch process?  Depths, feature sizes, stop layer material?  Also what model of DRIE system from SPTS is it?

Regards,


From: mtkhbeis at gmail.com<mailto:mtkhbeis at gmail.com> <mtkhbeis at gmail.com<mailto:mtkhbeis at gmail.com>>
Sent: Thursday, February 27, 2020 10:42 PM
To: Mick Krieg <Mick.Krieg at spts.com<mailto:Mick.Krieg at spts.com>>
Subject: Fwd: [labnetwork] SPTS DRIE Question

FYI
Dr. Michael Khbeis
(C) 443.254.5192<tel:443.254.5192>

Begin forwarded message:
From: bob.henderson at etchedintimeinc.com<mailto:bob.henderson at etchedintimeinc.com>
Date: February 27, 2020 at 1:05:26 PM PST
To: labnetwork at mtl.mit.edu<mailto:labnetwork at mtl.mit.edu>
Subject: [labnetwork] SPTS DRIE Question

I know a number of you have SPTS DRIE systems and I would like to ask what hardware configuration is necessary to prevent undercut (Footing) at the sacrificial stop layer at completion of etch. I have been told that it requires a different frequency generator than 13.56 MHz used for the bulk etch. Do the newer tools also have some method of endpoint on the stop layer or is it just a timed etch? Your help is appreciated

Bob Henderson
Etched In Time, Inc
941 S. Park Lane
Tempe, Arizona 85281
Phone: 602-206-6154
_______________________________________________
labnetwork mailing list
labnetwork at mtl.mit.edu<mailto:labnetwork at mtl.mit.edu>
https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork


Greg Hollingshead, Southwestern Regional Sales Manager
SPTS Technologies Ltd, A KLA Company
M. +1 (972) 342 9722    (Austin TX)     spts.com

-------------- next part --------------
An HTML attachment was scrubbed...
URL: <https://mtl.mit.edu/pipermail/labnetwork/attachments/20200228/06fef8a0/attachment.html>