[labnetwork] HSQ Alternatives

[Lapointe, Jean]

HI Long,

Also have a look at Dischem’s HSiQ made from the powder. It is cheaper than Dow Corning’s XR-1541 and the lead time is shorter than 2 weeks.
The Dischem HSiQ behaves almost the same as Dow’s but requires different bake conditions and needs to be filtered upon dispensing.

The Medusa resist has a slightly different composition (not really HSQ)  and we had severe adhesion issue to Si. It was only used for some initial test a few years ago but could not be used to pattern any submicron structures. Someone may have more recent results…

Jean

From: labnetwork [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Chang, Long
Sent: May 6, 2021 12:27 PM
To: labnetwork at mtl.mit.edu
Subject: [labnetwork] HSQ Alternatives


***ATTENTION*** This email originated from outside of the NRC. ***ATTENTION*** Ce courriel provient de l'extérieur du CNRC
Hi All,

I’m looking for HSQ alternatives since it’s expensive, has a 14 week lead time and comes in 250mL bottle. We waste most of the bottle due to it’s 6 months shelf life. Although we had some bottles still good after 2 years at 5C, it’s just a huge gamble after a year. We tried LN2 freezing, but it takes too much effort.

I’ve attached a table of the cost per mL for the alternatives I found assuming you want 100nm thick. The AQM and EMResist are in powder form and advertise 1 year powder shelf life and 3 months mixture shelf life. They can distribute the powder into many small bottles.

Particularly interesting is the Medusa 82 which has the lowest cost and advertises better shelf life. Does anyone have experience with these HSQ alternatives?

[cid:image001.png at 01D742A4.F9863170]

Thanks,
Long

-------------- next part --------------
An HTML attachment was scrubbed...
URL: <https://mtl.mit.edu/pipermail/labnetwork/attachments/20210506/54e0aba9/attachment.html>
-------------- next part --------------
A non-text attachment was scrubbed...
Name: image001.png
Type: image/png
Size: 16936 bytes
Desc: image001.png
URL: <https://mtl.mit.edu/pipermail/labnetwork/attachments/20210506/54e0aba9/attachment.png>