[labnetwork] Sapphire dicing

[Miller, Suzanne]

Here at Argonne, we use an ADT dicing saw with a resin blade with 46 micron grit
.8mm/s
slices of 100-150 microns
Yours
Suzanne

________________________________
From: labnetwork <labnetwork-bounces at mtl.mit.edu> on behalf of Ahdam Ali <aali at eng.ucsd.edu>
Sent: Monday, May 17, 2021 8:42 PM
To: Gloria Qiu <gloria.qiu at sydney.edu.au>
Cc: labnetwork at mtl.mit.edu <labnetwork at mtl.mit.edu>
Subject: Re: [labnetwork] Sapphire dicing

Gloria and Natalia,

I’ll write up a procedure and include consumables/parts. Discussions with a professional dicing service has taught me that it’s possible to dice sapphire with a single pass up to 1mm, but they dress very heavily for each sample (removing 20% of the samples thickness from the blade) and even they blow up blades. It’s quite a difficult material to dice. Depth steps seem to the most viable route.

Best,

Ahdam Ali
R&D Engineer II
UCSD Calit2 Nano3 Facility
Atkinson Hall M/C0436
9500 Gilman Drive
La Jolla, CA  92093-0436

Email: aali at eng.ucsd.edu<mailto:pdriscoll at eng.ucsd.edu>
Phone: (<tel:(858)-534-4768>858)-534-4768<tel:(858)-534-4768>

On May 17, 2021, at 4:54 PM, Gloria Qiu <gloria.qiu at sydney.edu.au> wrote:



Hi Natalia,



I’ve tried dicing 600um sapphire with resin hubless blade at 3mm/sec, 15krmp, and the blades always chip. The manufacturer also recommended depth-step as Ahdam suggested but I haven’t got time to try it. (It would be quite slow though).

My colleague at UNSW uses a standard procedure (one-step) with VT07/12 blades that I am keen to try. I found the blade and dicing information here and the result looks pretty decent.

https://www.aurotech.com/index.php/en/products/dicing-blade/vt07-12-series-detail



Hope this helps.





Best,



Gloria



Wenlan (Gloria) Qiu

Senior Process Engineer | Research & Prototype Foundry

Core Research Facilities | Research Portfolio



THE UNIVERSITY OF SYDNEY
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From: labnetwork <labnetwork-bounces at mtl.mit.edu> On Behalf Of Ahdam Ali
Sent: Saturday, May 15, 2021 1:12 AM
To: Natalia Pankratova <natalia.a.pankratova at gmail.com>
Cc: labnetwork at mtl.mit.edu
Subject: Re: [labnetwork] Sapphire dicing



Natalia,



At Nano3, we utilize a Disco DAD3220 Dicing Saw with Hubless blades in order to dice sapphire substrates. The process is relatively fool-proof, but one must be careful with dicing parameters. Cutting glass or sapphire typically require depth steps (multiple passes along a single cut) as well as very low feed speeds in order to ensure the integrity of the sample. This results in a considerably lower throughput when compared to dicing of a material such as Si.



Best,



On Fri, May 14, 2021 at 4:57 AM Natalia Pankratova <natalia.a.pankratova at gmail.com<mailto:natalia.a.pankratova at gmail.com>> wrote:

Dear All,



Can you please share your experience on dicing sapphire wafers? Blade dicing or laser? Do you have a favorite dicing brand/model?



Thank you in advance!



Best regards,



Natalia Pankratova.

Alice&Bob

Nanofabrication engineer

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--

Ahdam Ali

R&D Engineer II

UCSD Calit2 Nano3 Facility

Atkinson Hall M/C0436

9500 Gilman Drive

La Jolla, CA  92093-0436



Email: aali at eng.ucsd.edu<mailto:pdriscoll at eng.ucsd.edu>

Phone: (858)-534-4768
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