[labnetwork] Dicing glass/quartz or alumina with Disco DAD3240 saw

[Jim Carroll]

Hello Mario,

We also dice relatively thick glass and quartz substrates.  As already
mentioned, minimizing your blade exposure and a multipass cutting strategy
are a must for these types of substrates.  We may also have additional
recommendations depending on the specific blades, flanges, and tape (sizes,
part numbers) you are using.

Thanks,
Jim Carroll
*PhotomaskPORTAL*
*We help you make masks*
(415) 448-6275

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   <http://www.photomaskportal.com>



On Fri, Sep 10, 2021 at 6:47 AM N Shane Patrick <patricns at uw.edu> wrote:

> Hello Mario,
>
> Blade breakage with harder materials is always a challenge, but we’ve
> found Disco’s engineers to be quite responsive to dicing challenges and
> suggestions to solve them.
>
> For our in-house cutting on our DAD321, we’ve found different blades are
> needed for glass vs. Quartz/sapphire.
>
> We usually source our blades directly from Disco rather than thermocarbon
> (though we’ve used them in the past). Our current recommendations for the
> most common materials are the following:
>
> Silicon: ZH05 series
>
> Glass/Quartz: R07 series
>
> Sapphire: VT07 series
>
> We’ve also found switching to a multipass cutting strategy can help with
> harder/thicker materials. We also dice on Blue Tape for the vast majority
> of this work.
>
> My personal experience with bending/breaking has been that the blade is
> likely not rigorous enough to stand up to the hardness of the material
> being cut, so a slight deflection seems to become unrecoverable and
> eventually the blade deviates enough to break. I would, again however,
> strongly suggest getting in touch with Disco to discuss your particularly
> challenges and needs as, again, we’ve had very good response from them. I’m
> afraid I don’t have much in the way of direct recommendations, however, if
> you need to continue using thermocarbon blades.
>
> Good Luck.
>
> N. Shane Patrick
> Manager, Lab Operations and Safety
> Electron Beam Lithography
> Washington Nanofabrication Facility (WNF)
> National Nanotechnology Coordinated Infrastructure (NNCI)
> University of Washington - NanoES
> Fluke Hall 129, Box 352143
> (206) 221-1045
> patricns at uw.edu
> http://www.wnf.washington.edu/
>
> On Sep 9, 2021, at 3:52 PM, Beaudoin, Mario <beaudoin at physics.ubc.ca>
> wrote:
>
> We are having issues with cutting glass/quartz or alumina wafers with our
> Disco DAD3240 dicing saw
>
> We’re using composite Thermocarbon blades @ 20K rpm and tried feed speeds
> ranging between 0.5-5 mm/sec. Sample thickness varies but even for thinner
> ones (500-700 um) we’re having a problem that the blade breaks. Looks like
> the blade trajectory is bending during the cut and this causes catastrophic
> damage to the blade. Why this bending occurs is not clear. Maybe the
> problem is in the blue tape we use to secure samples, but we don’t observe
> any apparent displacement of the sample on the film.
>
> Anyone else having similar issues?  Any suggestions?
>
> Regards,
>
> Mario
> --
> <Mario Beaudoin SBQMI sig 2.jpg>
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