[labnetwork] Dicing glass/quartz or alumina with Disco DAD3240 saw

[Beaudoin, Mario]

BIG thanks to all who responded.  We have lots of avenues to explore.

Mario

On 2021-09-10 6:44 a.m., Jim Carroll wrote:
> [*CAUTION:* Non-UBC Email]
>
> Hello Mario,
>
> We also dice relatively thick glass and quartz substrates.  As already 
> mentioned, minimizing your blade exposure and a multipass cutting 
> strategy are a must for these types of substrates.  We may also have 
> additional recommendations depending on the specific blades, flanges, 
> and tape (sizes, part numbers) you are using.t
> Thanks,
> Jim Carroll
> *PhotomaskPORTAL*
> /We help you make masks/
> (415) 448-6275
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>     <http://www.photomaskportal.com>
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>
> On Fri, Sep 10, 2021 at 6:47 AM N Shane Patrick <patricns at uw.edu 
> <mailto:patricns at uw.edu>> wrote:
>
>     Hello Mario,
>
>     Blade breakage with harder materials is always a challenge, but
>     we’ve found Disco’s engineers to be quite responsive to dicing
>     challenges and suggestions to solve them.
>
>     For our in-house cutting on our DAD321, we’ve found different
>     blades are needed for glass vs. Quartz/sapphire.
>
>     We usually source our blades directly from Disco rather than
>     thermocarbon (though we’ve used them in the past). Our current
>     recommendations for the most common materials are the following:
>
>     Silicon: ZH05 series
>
>     Glass/Quartz: R07 series
>
>     Sapphire: VT07 series
>
>
>     We’ve also found switching to a multipass cutting strategy can
>     help with harder/thicker materials. We also dice on Blue Tape for
>     the vast majority of this work.
>
>     My personal experience with bending/breaking has been that the
>     blade is likely not rigorous enough to stand up to the hardness of
>     the material being cut, so a slight deflection seems to become
>     unrecoverable and eventually the blade deviates enough to break. I
>     would, again however, strongly suggest getting in touch with Disco
>     to discuss your particularly challenges and needs as, again, we’ve
>     had very good response from them. I’m afraid I don’t have much in
>     the way of direct recommendations, however, if you need to
>     continue using thermocarbon blades.
>
>     Good Luck.
>
>     N. Shane Patrick
>     Manager, Lab Operations and Safety
>     Electron Beam Lithography
>     Washington Nanofabrication Facility (WNF)
>     National Nanotechnology Coordinated Infrastructure (NNCI)
>     University of Washington - NanoES
>     Fluke Hall 129, Box 352143
>     (206) 221-1045
>     patricns at uw.edu <mailto:patricns at uw.edu>
>     http://www.wnf.washington.edu/ <http://www.wnf.washington.edu/>
>
>>     On Sep 9, 2021, at 3:52 PM, Beaudoin, Mario
>>     <beaudoin at physics.ubc.ca <mailto:beaudoin at physics.ubc.ca>> wrote:
>>
>>     We are having issues with cutting glass/quartz or alumina wafers
>>     with our Disco DAD3240 dicing saw
>>
>>     We’re using composite Thermocarbon blades @ 20K rpm and tried
>>     feed speeds ranging between 0.5-5 mm/sec. Sample thickness varies
>>     but even for thinner ones (500-700 um) we’re having a problem
>>     that the blade breaks. Looks like the blade trajectory is bending
>>     during the cut and this causes catastrophic damage to the blade.
>>     Why this bending occurs is not clear. Maybe the problem is in the
>>     blue tape we use to secure samples, but we don’t observe any
>>     apparent displacement of the sample on the film.
>>
>>     Anyone else having similar issues?  Any suggestions?
>>
>>     Regards,
>>
>>     Mario
>>
>>     -- 
>>     <Mario Beaudoin SBQMI sig 2.jpg>
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