[labnetwork] Oxford Wafer Jam/Break

[Football]

*Hi Long,*

*We had a very similar issue on an Oxford PECVD tool some time back. And it
was a ZTX 450 **transistor **on a board under the loadlock chamber that was
burnt out. And as others have mentioned, it can be identified by the
discolored place on the board. The service engineer from Oxford replaced
the board though.*
[image: image.png]




*Fubo Rao, Ph.D.,*

*Nanofabrication Cleanroom Manager,*

*Center for Nanoscale Materials,*

*Argonne National Laboratory*

*9700 S. Cass Ave, Lemont, IL 60439*

*Phone: 630-252-5708*

*Email: frao at anl.gov <frao at anl.gov>*

On Thu, Jun 23, 2022 at 8:50 AM Michael Perry <M.G.Perry at soton.ac.uk> wrote:

> Hi Long,
> Justin is likely to be right, as steve says, he knows his stuff. If its
> been failing for some time though it can also start to burn out one of the
> other transistors. Any that are discolored replace. Its sometimes easier to
> just snip the legs off and solder a new one to the legs to minimise risk of
> damage to pcb. Or if you want to future proof it, stick some sockets in
> there. Really common problem on oipt LL's. keep a batch on 450's and 550's
> as spares. They can fail as well.
>
> mike
>
> ------------------------------
> *From:* labnetwork <labnetwork-bounces at mtl.mit.edu> on behalf of Paolini,
> Steven <spaolini at cns.fas.harvard.edu>
> *Sent:* 22 June 2022 17:06
> *To:* Moreau, Justin <Justin_Moreau at uml.edu>; Chang, Long <
> lvchang at Central.UH.EDU>; labnetwork at mtl.mit.edu <labnetwork at mtl.mit.edu>
> *Subject:* Re: [labnetwork] Oxford Wafer Jam/Break
>
> *CAUTION:* This e-mail originated outside the University of Southampton.
>
> Long,
>
>   I misinterpreted your message yesterday. It would be wise to take
> Justin’s advice, he is the top dog when it comes to Oxford equipment.
>
> Steve
>
>
>
> Steve Paolini
>
> Principal Equipment Engineer
>
> Harvard University Center for Nanoscale Systems
>
> 11 Oxford St.
>
> Cambridge, MA 02138
>
> 617- 496- 9816
>
> spaolini at cns.fas.harvard.edu
>
> www.cns.fas.harvard.edu
>
>
>
> *From:* labnetwork <labnetwork-bounces at mtl.mit.edu> * On Behalf Of *Moreau,
> Justin
> *Sent:* Wednesday, June 22, 2022 7:59 AM
> *To:* Chang, Long <lvchang at Central.UH.EDU>; labnetwork at mtl.mit.edu
> *Subject:* Re: [labnetwork] Oxford Wafer Jam/Break
>
>
>
> Hi Long
>
>
>
> By jamming does the handler just stall?
>
> I don’t think adding more time or removing PR from your wafer edge will
> help.
>
> I suspect one of the handling sensors isn’t made, you have a mechanical
> bind (ff feedthrough, gearbox, linear bearing) or you have a failing drive
> transistor.
>
>
>
> Looking at your image- Slit valve is open, clamp is up, lift is up, arm is
> extended
>
>
>
> Is your “arm out”sensor made? If no you should adjust the arm out sensor.
>
>
>
> If the arm out sensor is made. Check for a mechanical bind-  Remove the
> mounting plate that holds the motor and gearbox assy. You can then try and
> rotate the ferrofluid feedthrough shaft by hand.
>
> If you can rotate, you don’t have a bind.
>
>
>
> This looks like a Blue PLC control system so it would likely be the Q4
> transistor on the LL control card that’s the problem. Its mounted just
> below the LL chamber. It can overheat and intermittently work. Q4 controls
> the drive back into the LL.
>
> It will also discolor so it should be easy to spot. You can replace it
> with a ZTX450 NPN.
>
>
>
>
>
>
>
> Hope this helps
>
>
>
>
>
>
>
>
>
>
>
>
>
>
>
>
>
> [image: University of Massachusetts Lowell]
>
> *Justin Moreau*
>
> *Sr. Lab Manager, Nanofabrication Core*
>
> CORE RESEARCH FACILITIES
>
> ETIC
>
> *E:* Justin_Moreau at uml.edu
>
> *T:* 978-934-3615
>
>
>
>
>
> *From:* labnetwork <labnetwork-bounces at mtl.mit.edu> *On Behalf Of *Chang,
> Long
> *Sent:* Tuesday, June 21, 2022 2:51 PM
> *To:* labnetwork at mtl.mit.edu
> *Subject:* [labnetwork] Oxford Wafer Jam/Break
>
>
>
> *This e-mail originated from outside the UMass Lowell network.*
> ------------------------------
>
> Hi Guys,
>
>
>
> After etching through 380um of Silicon, the loading arm would get jammed
> during unloading, see photo. The problem was fixed by adding a 15min step
> to do nothing step to allow the clamp to cool down before unloading. Now
> the problem is back and the plan is to increase the cool down time until it
> stops jamming. Is there a better way to avoid this problem? Should the PR
> on the wafer edge be removed?
>
>
>
> Thanks,
>
> Long
>
> _______________________________________________
> labnetwork mailing list
> labnetwork at mtl.mit.edu
> https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork
>
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