[labnetwork] Questions on NiFe electroplating of wafers

[Coleman Murray]

Hello,
We currently have a process for electroplating NiFe structures onto glass
wafers via a copper seed layer (Ti-Cu-Ti sandwich). We are looking to scale
production of our glass chips to large panel formats but many vendors we
are talking to are worried about copper contamination. Instead they prefer
a Moly/Al/Moly.

I'm interested in performing the NiFe plating using an Aluminum seed layer
instead of Copper. Is this possible?

Best,
Coleman Murray, PhD
Chief Operating Officer
Ferrologix, Inc.


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