[labnetwork] Safety Protocols for Physical (Wet) Cleans on Gallium Arsenide Etch Tools

[William Kiether]

We are adding Gallium Arsenide (and potentially InP) devices to the allowed
materials in one of our Oxford Plasmalab 100 ICP/RIE systems using BCl3/Cl
etch chemistry. My question concerns safety protocols, especially for
mechanical/wet cleans of the chamber. Does anyone doing these types of
etches have extra protocols, e.g. long cleaning etches, respirators, etc in
place for opening and physically cleaning the chamber or any other aspects
for handling GaAs residue.  This system has a load lock, but sees a wide
variety of materials and requires frequent mechanical/wet cleans in the
main chamber.

Bill Kiether
NCSU Nanofabrication Facility
wjkiethe at ncsu.edu
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