[labnetwork] Photoresist Spray Coater & Spinner

[Garry J. Bordonaro]

Ben,

 

At CNF we have used a Suss AltaSpray for several years with very good success.  Ours is integrated into our Gamma cluster, but stand-alone versions are available.  ClassOne has one that needs a rebuild.  It uses an X Y spray motion with a heated chuck.

 

One of our staff worked out DUV lift-off using HSQ.  We also have a C&D lift-off tool with high-pressure jet that give good results on poor processes.  I could send the details if you are interested.

 

 

Garry J. Bordonaro

Microlithographic Engineer

Cornell NanoScale Facility

250 Duffield Hall

343 Campus Road

Ithaca NY 14853-2700

(607) 254-4936

 <mailto:bordonaro at cnf.cornell.edu> bordonaro at cnf.cornell.edu

 <http://www.cnf.cornell.edu/> http://www.cnf.cornell.edu/

 

Please acknowledge CNF in your publications:

"This work was performed in part at the Cornell NanoScale Science & Technology Facility (CNF), a member of the National Nanotechnology Coordinated Infrastructure (NNCI), which is supported by the National Science Foundation (Grant NNCI-2025233)."

 

 

 

 

From: labnetwork <labnetwork-bounces at mtl.mit.edu> On Behalf Of S. J. Ben Yoo
Sent: Tuesday, September 15, 2026 5:45 PM
To: Labnetwork <labnetwork at mtl.mit.edu>
Subject: [labnetwork] Photoresist Spray Coater & Spinner

 

Hi, Everyone,

 

Two questions for you.

 

(1) At UC Davis we are trying to acquire a tool that can spin coat and spray coat photoresist.    Do you have a good recommendation for a new tool or used one for less than 200k, preferably below 140k?

I received a quotation from EVG for a new tool EVG101.  We like what we saw on the spec sheet and descriptions but the price is a bit on the high side for us.  Looking for a used unit, I got a quote for an old unit that is not supported (and we need to purchase one that has manufacturers’ support and maintenance).

Any suggestion would be appreciated.

 

(2) We are also trying to setup a bilevel resist exposure capability for high resolution metal liftoff.  My group members have been using LOR under the photoresist to give an undercut under the photoresist during the development but it is not a well-controlled process.

At my former lab, Bellcore, two types of photoresist : g-line (436 nm) and i-line (365 nm).  After the I-line litho and development, using g-line flood exposure at angled spin exposure worked very well.

Anyone knows of a good g-line exposure system for bilevel liftoff?

We also use DUV ASML stepper, hence we could also try g-line (436 nm) and DUV (248 nm) bilevel liftoff.





Any suggestion would be appreciated.

 

Thanks,

 

-Ben

 

 

_______________________________________________________________________________

S. J. Ben Yoo
Joint Faculty LBL and UC Davis 
Distinguished Professor, Department of Electrical and Computer Engineering
Room 3110, Kemper Hall
Mail Code 1915
University of California
Davis, California 95616
Mobile: (510) 407-2457
Fax: (530) 752-8428
email: sbyoo at ucdavis.edu <mailto:sbyoo at ucdavis.edu> 
home page: http://sierra.ece.ucdavis.edu
_______________________________________________________________________________ 

 

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