[labnetwork] RIE through Silicon

[Jeremy Upham]

I think your plan could work, so I'm not sure that I see the problem

In my experience the carbon in the PR can contribute to the plasma
chemistry and affect the etch, so I tend to use vacuum grease as a
thermally conducting binder between the etched sample and the backing wafer
instead. Though your system may well work for your recipe.

Hope that helps,

Jer Upham PhD
Senior Lab Manager / Research Scientist
Quantum Photonics Group
University of Ottawa
Tel.: 1 (613) 562-5800 ext 7325


On Mon, Apr 11, 2022 at 6:54 PM Chang, Long <lvchang at central.uh.edu> wrote:

> *Attention : courriel externe | external email*
> Hi Guys,
>
> I have an Oxford RIE with backside Helium. I want to etch through the
> silicon wafer (380um thick). The largest pattern is a 1mm diameter circle.
> My plan is to ride the 4” sample wafer on a 4" carrier wafer with PR. Does
> anyone have a good solution to this problem?
>
> Thanks,
> Long
>
>
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