[labnetwork] RIE through Silicon

[Hollingshead, Dave]

Hi Long,

We do this routinely with our DRIE system. As Jer mentioned, we typically use small drops of santovac 5 oil to adhere the two wafers together to provide thermal conduction. In our case we see etch rate changes or PR “burning” without a good thermal conductor between the samples.

-Dave

From: labnetwork <labnetwork-bounces at mtl.mit.edu> On Behalf Of Jeremy Upham
Sent: Monday, April 11, 2022 23:08
Cc: labnetwork at mtl.mit.edu
Subject: Re: [labnetwork] RIE through Silicon

I think your plan could work, so I'm not sure that I see the problem In my experience the carbon in the PR can contribute to the plasma chemistry and affect the etch, so I tend to use vacuum grease as a thermally conducting binder between 
I think your plan could work, so I'm not sure that I see the problem

In my experience the carbon in the PR can contribute to the plasma chemistry and affect the etch, so I tend to use vacuum grease as a thermally conducting binder between the etched sample and the backing wafer instead. Though your system may well work for your recipe.

Hope that helps,

Jer Upham PhD
Senior Lab Manager / Research Scientist
Quantum Photonics Group
University of Ottawa
Tel.: 1 (613) 562-5800 ext 7325


On Mon, Apr 11, 2022 at 6:54 PM Chang, Long <lvchang at central.uh.edu<mailto:lvchang at central.uh.edu>> wrote:
Attention : courriel externe | external email
Hi Guys,

I have an Oxford RIE with backside Helium. I want to etch through the silicon wafer (380um thick). The largest pattern is a 1mm diameter circle. My plan is to ride the 4” sample wafer on a 4" carrier wafer with PR. Does anyone have a good solution to this problem?

Thanks,
Long

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