[labnetwork] 200mm Bulk Silicon Etch Process Needed

[Randall Parker]

We have a need to etch a thin layer of silicon off of 200mm wafers. The silicon layer is freshly ground and unpatterned. Etch needs to have sufficient oxide selectivity to stop within a buried oxide layer which is 0.2-1.0um thick. Entire silicon layer needs to be removed (ex. no edge exclusion due to clamping ring).

Requested etch is similar to removing a 10um device silicon layer off an SOI wafer and stopping in BOX layer...

Open to wet or dry etch methods. If wet,  single-sided processing is preferred to prevent etching back of wafer, but a tank etch is acceptable if a viable option exists.

Can anyone point me towards a service or lab facility that could perform this etch in low volumes (10-12 wafers/month)?

Thanks for your input.

Randy Parker
Sr. Process Engineer
American Semiconductor, Inc.
208-336-2773, ext 23

All content and attachments are ASI confidential and proprietary.

-------------- next part --------------
An HTML attachment was scrubbed...
URL: <https://mtl.mit.edu/pipermail/labnetwork/attachments/20230914/561ca46e/attachment.html>